Intel and Siemens Join Forces to Boost Factory Efficiency and Sustainability in Race Against TSMC

5 Dec 2023 , 11:48 AM

Intel and Siemens collaborate for three years on factory efficiency and automation. Intel emphasizes resource efficiency and a commitment to net-zero emissions in its expansion plans.

Facing competition from TSMC, Intel invests billions in a shift to advanced chip tech like extreme ultraviolet (EUV) lithography. Siemens partnership aims to enhance Intel’s factory operations, particularly focusing on EUV technology. EUV lithography is crucial for advanced chipmaking, and Siemens seeks to transfer this expertise to other industries.

Siemens, known for similar collaborations, assisted Mercedes-Benz in transitioning to electric vehicle manufacturing. Cedrik Neike, Siemens digital industries chief, sees potential for their expertise beyond semiconductors.

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